On January 22, Tongwei Co., Ltd. (SH:600438) announced that it had completed the issuance of the first phase of green technology innovation bonds for 2026. The bond is abbreviated as “26 Tongwei GN001 (Sci-Tech Innovation Bond)” with the code “132680004.” It has a maturity period of 1+1 years and an actual issuance amount of 500 million yuan, with an issuance interest rate of 2.15%. The funds raised from this issuance have been fully received.
