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Tongwei Wins PVEL’s “Top Performer Module Manufacturer” Title Again

Recently, Kiwa PVEL (PVEL), a globally leading laboratory for reliability and performance testing of photovoltaic (PV) modules, released its “2025 PV Module Reliability Scorecard.” In the announced test results, Tongwei Solar’s TNC modules achieved the best performance across the entire reliability test sequence, comprehensively proving that Tongwei Solar’s TNC modules not only meet IEC standards but also fulfill reliability requirements under various extreme and harsh environmental conditions. This directly showcases the outstanding reliability and performance advantages of Tongwei Solar’s modules. As a result, Tongwei Solar has become one of only two PV manufacturers among the TOP10 module vendors to pass all seven rigorous reliability tests for PV modules and has been honored with PVEL’s 2025 “Top Performer Module Manufacturer” title. This marks the second consecutive year Tongwei Solar has received this accolade since fully entering the module business.

PVEL conducts accelerated tests that exceed IEC certification standards each year to simulate the reliability performance of modules under different extreme environmental conditions, serving as an important benchmark for the industry to measure the long-term reliability and performance of PV modules. The 2025 PVEL tests include seven listed test sequences: TC600, DH2000, PID192, LeTID486, MSS (Mechanical Stress Sequence), HSS (Hail Stone Sequence, 40mm), and Panfile, with the addition of a new UV120 test sequence.

Building on the continuous validation of the reliability performance of its TNC modules, Tongwei Solar is also striving towards higher efficiency and greater value. Tongwei Solar’s TNC 2.0 modules, launched in 2025, are based on four core technologies: the 908 technology (Tongwei Solar’s self-developed 0BB technology), TPE technology, Poly Tech, and stencil printing. These technologies fully unlock the potential of N-type modules, broaden the efficiency boundaries of the modules, and achieve simultaneous improvements in module efficiency, power, and bifaciality, laying a solid foundation for subsequent technological iterations and functional expansions.

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